Browsing by Author "Said, M."

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A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias

Said, M.; Shalaby, A.; Madipour, Farhad; Morteza, B.; El-Sayed, M. (Elsevier, 2016)

The use of short Through-Silicon Vias (TSVs) in 3D integration Technology introduces a significant reduction in routing area, power consumption, and delay. Although, there are still several challenges in 3D integration ...
A design methodology for performance maintenance of 3D Network-on-Chip with multiplexed Through-Silicon Vias

Madipour, Farhad; El-Sayed, M.; Murakami, K.; Said, M. (ACM DL (Digital Library), 2015-06)

3D integration is an emerging technology that overcomes 2D integration process limitations. The use of short Through-Silicon Vias (TSVs) introduces a significant reduction in routing area, power consumption, and delay. ...