• Keep-Out-Zone analysis for three-dimensional ICs 

      Said, Mostafa; Madipour, Farhad; El-Sayed, Mohamed (Institute of Electrical and Electronics Engineers (IEEE), 2014-04)
      One of main challenges of 3D-integration is the area overhead which has two main causes: first the huge TSV diameter which is usually in the range of microns, and the second reason is the Keep-Out-Zone (KOZ) overhead due ...